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| TPCA8109 TOSHIBA Field Effect Transistor Silicon P Channel MOS Type (U-MOS) TPCA8109 Lithium Ion Battery Applications Power Management Switch Applications 8 Unit: mm 1.27 0.4 0.1 5 0.05 M A * * * Low drain-source ON-resistance: RDS (ON) = 7 m (typ.) Low leakage current: IDSS = -10 A (max) (VDS = -30 V) Enhancement mode: Vth = -0.8 to -2.0 V (VDS = -10 V, ID = -0.5mA) 6.0 0.3 5.0 0.2 * Small footprint due to small and thin package 0.15 0.05 1 0.95 0.05 4 0.595 0.166 0.05 4 A Absolute Maximum Ratings (Ta = 25C) Characteristics Drain-source voltage Drain-gate voltage (RGS = 20 k) Gate-source voltage Drain current DC (Note 1) Symbol VDSS VDGR VGSS ID IDP PD PD PD EAS IAR Tch Tstg Rating -30 -30 -25/+20 -24 -72 30 2.8 Unit 5.0 0.2 V V V A W W 8 5 0.6 0.1 1 4.25 0.2 Pulsed (Note 1) (Tc=25C) (t = 10 s) (Note 2a) Drain power dissipation Drain power dissipation (t = 10 s) (Note 2b) 1.6 W 1,2,3SOURCE 4GATE 5,6,7,8DRAIN Single pulse avalanche energy (Note 3) Avalanche current Channel temperature Storage temperature range JEDEC 75 -24 150 -55 to 150 mJ A C C 2-5Q1A JEITA TOSHIBA Weight: 0.076 g (typ.) Note: For Notes 1 to 3, refer to the next page. Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). This transistor is an electrostatic sensitive device. Please handle with caution. Circuit Configuration 8 7 6 5 1 2 3 0.8 0.1 Drain power dissipation 3.5 0.2 1.1 0.2 S 0.05 S 4 1 2009-12-03 TPCA8109 Thermal Characteristics Characteristics Thermal resistance, channel to case (Tc=25C) Thermal resistance, channel to ambient (t = 10 s) (Note 2a) Symbol Rth (ch-c) Max 4.17 Unit C/W Rth (ch-a) 44.6 C/W Thermal resistance, channel to ambient (t = 10 s) (Note 2b) Rth (ch-a) 78.1 C/W Marking (Note 4) TPCA 8109 * Type Lot No. Note 1: Please use devices on condition that the channel temperature is below 150C. Note 2: (a) Device mounted on a glass-epoxy board (a) (b) Device mounted on a glass-epoxy board (b) FR-4 25.4 x 25.4 x 0.8 (Unit: mm) FR-4 25.4 x 25.4 x 0.8 (Unit: mm) (a) (b) Note 3: VDD = -24 V, Tch = 25C (initial), L = 100H, RG = 25 , IAR = -24 A Note 4: * Weekly code: (Three digits) Week of manufacture (01 for first week of year, continues up to 52 or 53) Year of manufacture (One low-order digits of calendar year) 2 2009-12-03 TPCA8109 Electrical Characteristics (Ta = 25C) Characteristics Gate leakage current Drain cut-OFF current Drain-source breakdown voltage Gate threshold voltage Drain-source ON resistance Input capacitance Reverse transfer capacitance Output capacitance Rise time Turn-on time Switching time Fall time tf toff Qg Qgs1 Qgd VDD -24 V, VGS = -10 V, ID = -24 A Symbol IGSS IDSS V (BR) DSS V (BR) DSX Vth RDS (ON) Ciss Crss Coss tr ton 0V VGS -10 V 4.7 ID = -12 A VOUT RL = 1.25 VDS = -10 V, VGS = 0 V, f = 1 MHz Test Condition VGS = 20 V, VDS = 0 V VDS = -30 V, VGS = 0 V ID = -10 mA, VGS = 0 V ID = -10 mA, VGS = 10 V (Note5) VDS = -10 V, ID = - 0.5 mA VGS = -4.5V, ID = -12 A VGS = -10 V, ID = -12 A Min -30 -21 -0.8 Typ. 10 7 2400 400 460 9.2 16 58 Max 100 -10 -2.0 13 9 ns nC pF Unit nA A V V m VDD -15 V Turn-off time Total gate charge (gate-source plus gate-drain) Gate-source charge 1 Gate-drain ("miller") charge Duty 1%, tw = 10 s 172 56 5.6 15 Source-Drain Ratings and Characteristics (Ta = 25C) Characteristics Drain reverse current Forward voltage (diode) Pulse (Note 1) Symbol IDRP VDSF Test Condition IDR = -24 A, VGS = 0 V Min Typ. Max -72 1.2 Unit A V Note 5: V(BR)DSX mode (the application of a plus voltage between gate and source) may cause decrease in maximum rating of drain-source voltage. 3 2009-12-03 TPCA8109 -10 -6 -4.5 -10 -3 -8 ID - VDS -2.6 Common source -2.4 Ta = 25C Pulse test -50 -10 -6 ID - VDS -3.6 -3.2 -3 Common source Ta = 25C Pulse test -2.8 (A) ID -6 ID (A) -2.3 -40 -4.5 -2.2 -30 Drain current -4 -2.1 -2 -2 0 0 VGS = -1.9 V -0.2 -0.4 -0.6 -0.8 -1 Drain current -2.6 -20 -2.4 -10 -2.2 0 0 VGS = -2 V -1.6 -2 -0.4 -0.8 -1.2 Drain-source voltage VDS (V) Drain-source voltage VDS (V) ID - VGS -50 VDS - VGS -0.5 (A) -40 VDS (V) Common source VDS = -10 V Pulse test 25 Ta = -55C 100 -0.4 Common source Ta = 25C Pulse test ID -20 Drain-source voltage -30 -0.3 Drain current -0.2 ID = -24 A -10 -0.1 -12 -6 0 0 -1 -2 -3 -4 0 0 -4 -8 -12 -16 -20 Gate-source voltage VGS (V) Gate-source voltage VGS (V) RDS (ON) - ID 100 Common source Ta = 25C Pulse test Drain-source ON-resistance RDS (ON) (m) 10 -4.5 VGS = -10 V 1 -0.1 -1 -10 -100 Drain current ID (A) 4 2009-12-03 TPCA8109 RDS (ON) - Ta 20 -100 IDR - VDS (A) -10 -4.5 -10 -1 VGS = 0 V Common source Pulse test Drain-source ON-resistance RDS (ON) (m) 16 ID = -6, -12, -24 A 12 VGS = -4.5 V 8 ID = -6, -12, -24 A VGS = -10 V -3 Drain reverse current IDR -1 4 Common source Ta = 25C Pulse test -0.1 0 0.2 0.4 0.6 0.8 1 1.2 0 -80 -40 0 40 80 120 160 Ambient temperature Ta (C) Drain-source voltage VDS (V) Capacitance - VDS 10000 -2 Vth - Ta Vth (V) Gate threshold voltage Ciss (pF) -1.6 -1.2 Capacitance C 1000 -0.8 Common source VDS = -10 V ID = -0.5mA Pulse test -40 0 40 80 120 160 100 -0.1 Common source VGS = 0 V f = 1 MHz Ta = 25C -1 -10 Coss Crss -0.4 -100 0 -80 Drain-source voltage VDS (V) Ambient temperature Ta (C) Dynamic input/output characteristics -30 VDS (V) -25 VDD = -24 V VDS -30 Common source ID = -24 A Ta = 25C -25 Pulse test -20 -20 Drain-source voltage -15 -12 -10 -6 -5 VGS -6 VDD = -24 V -12 -15 -10 -5 0 0 20 40 60 80 100 0 Total gate charge Qg (nC) Gate-source voltage VGS (V) 5 2009-12-03 TPCA8109 rth - tw 1000 (1) Device mounted on a glass-epoxy board (a) (Note 2a) (2) Device mounted on a glass-epoxy board (b) (Note 2b) (3) Tc = 25 (2) Transient thermal impedance rth (C/W) 100 (1) 10 (3) 1 0.1 Single Pulse 0.01 0.0001 0.001 0.01 0.1 1 10 100 1000 Pulse width tw (s) PD - Ta 3 (1)Device mounted on a glass-epoxy PD - Tc 40 (W) 2.5 (1) (2)Device mounted on a glass-epoxy board(b) t = 10 s (Note 2b) PD PD Drain power dissipation 120 160 (W) 30 20 10 0 board(a) (Note 2a) Drain power dissipation 2 (2) 1.5 1 0.5 0 0 40 80 0 40 80 120 160 Ambient temperature Ta (C) Case temperature Tc (C) Safe operating area -1000 ID (A) -100 ID max (Pulse) * 1 ms * -10 t = 10 ms * Drain current -1 -0.1 -0.1 *: Single pulse Ta = 25C Curves must be derated linearly with increase in temperature. -1 VDSS max -10 -100 Drain-source voltage VDS (V) 6 2009-12-03 TPCA8109 RESTRICTIONS ON PRODUCT USE * Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. * Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. * Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact ("Unintended Use"). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document. * Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. * Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. * The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. * ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. * Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. * Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 7 2009-12-03 |
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